- Patent Title: Compact printed circuit board assembly with insulating endcap via
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Application No.: US15682354Application Date: 2017-08-21
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Publication No.: US10292278B2Publication Date: 2019-05-14
- Inventor: Thomas Lee Schick , Robert Matousek , Sunil Anuprasad Patel
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Holzer Patel Drennan
- Main IPC: G11B33/12
- IPC: G11B33/12 ; H05K3/34 ; G11B5/48 ; H05K1/02 ; H05K1/16 ; H05K1/18

Abstract:
A compact printed circuit board assembly includes a printed circuit board (PCB) and a preamplifier subassembly. The preamplifier subassembly includes a preamplifier and an insulating endcap abutting one another and arranged in a plane parallel to the PCB. An electrical via formed within the first insulating endcap provides an electrical connection between a decoupling capacitor and the PCB to reduce noise detectable in current flowing between the preamplifier and a current source.
Public/Granted literature
- US20190059161A1 COMPACT PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2019-02-21
Information query
IPC分类: