公开(公告)号：US20190059161A1

公开(公告)日：2019-02-21

申请号：US15682354

申请日：2017-08-21

Applicant: Seagate Technology LLC

Inventor： Thomas Lee Schick ,  Robert Matousek ,  Sunil Anuprasad Patel

IPC: H05K3/34 ,  G11B5/48 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18

Abstract: A compact printed circuit board assembly includes a printed circuit board (PCB) and a preamplifier subassembly. The preamplifier subassembly includes a preamplifier and an insulating endcap abutting one another and arranged in a plane parallel to the PCB. An electrical via formed within the first insulating endcap provides an electrical connection between a decoupling capacitor and the PCB to reduce noise detectable in current flowing between the preamplifier and a current source.

公开(公告)号：US10292278B2

公开(公告)日：2019-05-14

申请号：US15682354

申请日：2017-08-21

Applicant: Seagate Technology LLC

Inventor： Thomas Lee Schick ,  Robert Matousek ,  Sunil Anuprasad Patel

IPC: G11B33/12 ,  H05K3/34 ,  G11B5/48 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18

Abstract: A compact printed circuit board assembly includes a printed circuit board (PCB) and a preamplifier subassembly. The preamplifier subassembly includes a preamplifier and an insulating endcap abutting one another and arranged in a plane parallel to the PCB. An electrical via formed within the first insulating endcap provides an electrical connection between a decoupling capacitor and the PCB to reduce noise detectable in current flowing between the preamplifier and a current source.