Invention Grant
- Patent Title: Thermosetting resin composition for semiconductor package and prepreg using the same
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Application No.: US15572390Application Date: 2016-12-28
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Publication No.: US10294341B2Publication Date: 2019-05-21
- Inventor: Hwa Yeon Moon , Yong Seon Hwang , Hee Yong Shim , Hyun Sung Min , Mi Seon Kim , Chang Bo Shim , Young Chan Kim , Seung Hyun Song , Won Ki Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2016-0004390 20160113
- International Application: PCT/KR2016/015418 WO 20161228
- International Announcement: WO2017/122952 WO 20170720
- Main IPC: C08K9/06
- IPC: C08K9/06 ; C08J5/24 ; C08L33/08 ; C08L33/24 ; C08L63/00 ; H01L23/29 ; C08L65/02 ; H01L23/14 ; H01L23/00 ; C08L61/14 ; H01L23/373 ; H01L23/42
Abstract:
The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.
Public/Granted literature
- US20180148555A1 Thermosetting resin composition for semiconductor package and prepreg using the same Public/Granted day:2018-05-31
Information query
