Invention Grant
- Patent Title: Levelers for copper deposition in microelectronics
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Application No.: US14854561Application Date: 2015-09-15
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Publication No.: US10294574B2Publication Date: 2019-05-21
- Inventor: Kyle Whitten , Vincent Paneccasio, Jr. , Thomas Richardson , Eric Rouya
- Applicant: MacDermid Enthone Inc.
- Applicant Address: US CT Waterbury
- Assignee: MacDermid Enthone Inc.
- Current Assignee: MacDermid Enthone Inc.
- Current Assignee Address: US CT Waterbury
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D7/12
Abstract:
A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound.
Public/Granted literature
- US20160076160A1 LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS Public/Granted day:2016-03-17
Information query
