Invention Grant
- Patent Title: TO-Can photodiode package with integrated coupling member and exposed active region, and a receiver optical subassembly (ROSA) using the same
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Application No.: US15413514Application Date: 2017-01-24
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Publication No.: US10295765B2Publication Date: 2019-05-21
- Inventor: Kai-Sheng Lin , YongXuan Liang , Justin Lii
- Applicant: Applied Optoelectronics, Inc.
- Applicant Address: US TX Sugar Land
- Assignee: Applied Optoelectronics, Inc.
- Current Assignee: Applied Optoelectronics, Inc.
- Current Assignee Address: US TX Sugar Land
- Agency: Grossman Tucker Perreault & Pfleger
- Agent Norman S. Kinsella
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H04B10/40 ; H04B10/60 ; H04B10/66 ; H04B10/69

Abstract:
A photodiode package is disclosed that includes a TO-Can style body with an exposed sensor cavity that eliminates the necessity of an encapsulant dispensing process. The TO-Can body of the photodiode package includes an integrated coupling member to allow for coupling to a ROSA housing without an intermediate member. The photodiode package includes a base portion with a cylindrical wall portion that extends therefrom to form an optical coupling cavity. A surface of the base portion provides at least one mounting surface within the optical coupling cavity for coupling to a photodiode chip. The cylindrical wall may function as an integrated coupling member and may be used to directly couple the photodiode package, e.g., without an intermediate cap/ring, into a socket of a ROSA housing. The base portion and cylindrical wall may be formed from a single piece of material, or from multiple pieces depending on a desired configuration.
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