- Patent Title: Method of forming a wrap-around contact on a semiconductor device
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Application No.: US15642569Application Date: 2017-07-06
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Publication No.: US10297499B2Publication Date: 2019-05-21
- Inventor: Jeffrey S. Leib , Ralph T. Troeger , Daniel Bergstrom
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jordan IP Law, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/528 ; H01L21/285 ; H01L21/768 ; H01L29/417 ; H01L23/532 ; H01L23/535 ; H01L29/78
Abstract:
Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.
Public/Granted literature
- US20170309516A1 METHOD OF FORMING A WRAP-AROUND CONTACT ON A SEMICONDUCTOR DEVICE Public/Granted day:2017-10-26
Information query
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