- 专利标题: Semiconductor device and method
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申请号: US15864793申请日: 2018-01-08
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公开(公告)号: US10297508B2公开(公告)日: 2019-05-21
- 发明人: Chao-Ching Cheng , Tzu-Chiang Chen , Chen-Feng Hsu , Yu-Lin Yang , Tung Ying Lee , Chih Chieh Yeh
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/82
- IPC分类号: H01L21/82 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L29/66 ; H01L21/02 ; H01L21/306
摘要:
Nanowire devices and fin devices are formed in a first region and a second region of a substrate. To form the devices, alternating layers of a first material and a second material are formed, inner spacers are formed adjacent to the layers of the first material, and then the layers of the first material are removed to form nanowires without removing the layers of the first material within the second region. Gate structures of gate dielectrics and gate electrodes are formed within the first region and the second region in order to form the nanowire devices in the first region and the fin devices in the second region.
公开/授权文献
- US20190067122A1 Semiconductor Device and Method 公开/授权日:2019-02-28
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