Invention Grant
- Patent Title: Non-metallic vapor chambers
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Application No.: US14959010Application Date: 2015-12-04
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Publication No.: US10302367B2Publication Date: 2019-05-28
- Inventor: Mark MacDonald
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28F21/06 ; H01L23/427

Abstract:
A non-metallic vapor chamber includes a composite wick structure that fills a non-metallic housing. The composite wick structure provides mechanical strength and structural rigidity to the non-metallic vapor chamber. The composite wick structure includes a first hydrophilic wick portion and a second hydrophobic wick portion. A condensed working fluid flows through the first hydrophilic wick portion from a condensation region to a region proximate one or more thermal energy producing devices. A vaporized working fluid flows through the second hydrophobic wick portion from the region proximate one or more thermal energy producing devices to a condensation region where the vaporized working fluid is condensed for reuse.
Public/Granted literature
- US20170160017A1 NON-METALLIC VAPOR CHAMBERS Public/Granted day:2017-06-08
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