- Patent Title: Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof
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Application No.: US15791888Application Date: 2017-10-24
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Publication No.: US10304779B2Publication Date: 2019-05-28
- Inventor: Makoto Orikasa , Yuhei Horikawa , Hisayuki Abe , Yoshihiro Kanbayashi
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/3205 ; H01L21/56 ; H01L21/288 ; H01L23/31 ; H01L23/00
Abstract:
Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.
Public/Granted literature
- US20180114759A1 ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-04-26
Information query
IPC分类:
