Invention Grant
- Patent Title: Solid-state imaging device, production method of the same, and imaging apparatus
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Application No.: US16199529Application Date: 2018-11-26
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Publication No.: US10304879B2Publication Date: 2019-05-28
- Inventor: Keiji Mabuchi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2007-138081 20070524
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/335 ; H01L27/146 ; H04N5/369 ; H04N5/3745 ; H04N5/378 ; H04N9/04 ; H04N5/357 ; H01L31/0352

Abstract:
A solid-state imaging device in which a pixel circuit formed on the first surface side of a semiconductor substrate is shared by a plurality of light reception regions and second surface side of the semiconductor substrate is the light incident side of the light reception regions. The second surface side regions of the light reception regions are arranged at approximately even intervals and the first surface side regions of the light reception regions e are arranged at uneven intervals. Respective second surface side regions and first surface side regions are joined in the semiconductor substrate so that the light reception regions extend from the second surface side to the first surface side of the semiconductor substrate.
Public/Granted literature
- US20190123077A1 SOLID-STATE IMAGING DEVICE, PRODUCTION METHOD OF THE SAME, AND IMAGING APPARATUS Public/Granted day:2019-04-25
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