Invention Grant
- Patent Title: Image sensor
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Application No.: US15862396Application Date: 2018-01-04
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Publication No.: US10304887B2Publication Date: 2019-05-28
- Inventor: Han-seok Kim , Byung-jun Park , Hee-geun Jeong , Seung-joo Nah
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2017-0040214 20170329
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.
Public/Granted literature
- US20180286896A1 IMAGE SENSOR Public/Granted day:2018-10-04
Information query
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