- 专利标题： Cooling trough, cooler and power module assembly
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申请号： US15528161申请日： 2015-11-19
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公开(公告)号： US10306800B2公开(公告)日： 2019-05-28
- 发明人: Franke Wulf-Toke , Ronald Eisele , Reiner Hinken , Frank Osterwald , Klaus Olesen , Lars Paulsen
- 申请人： DANFOSS SILICON POWER GMBH
- 申请人地址： DE Flensburg
- 专利权人： Danfoss Silicon Power GmbH
- 当前专利权人： Danfoss Silicon Power GmbH
- 当前专利权人地址： DE Flensburg
- 代理机构： McCormick, Paulding & Huber LLP
- 优先权： DE202014106063U 20141216
- 国际申请： PCT/EP2015/077093 WO 20151119
- 国际公布： WO2016/096316 WO 20160623
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H02B1/56 ; H01L23/10 ; H01L23/367
摘要：
The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.
公开/授权文献
- US20170332515A1 COOLING TROUGH, COOLER AND POWER MODULE ASSEMBLY 公开/授权日：2017-11-16
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