ELECTRONIC POWER SYSTEM AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20220071066A9

    公开(公告)日:2022-03-03

    申请号:US17226219

    申请日:2021-04-09

    IPC分类号: H05K7/20

    摘要: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

    ELECTRONIC POWER SYSTEM AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210227726A1

    公开(公告)日:2021-07-22

    申请号:US17226219

    申请日:2021-04-09

    IPC分类号: H05K7/20

    摘要: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

    POWER MODULE WITH INTEGRATED COOLING DEVICE
    4.
    发明申请

    公开(公告)号:US20200187385A1

    公开(公告)日:2020-06-11

    申请号:US16642481

    申请日:2018-09-25

    IPC分类号: H05K7/20

    摘要: An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

    Power module with integrated cooling device

    公开(公告)号:US11134587B2

    公开(公告)日:2021-09-28

    申请号:US16642481

    申请日:2018-09-25

    摘要: An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

    Electronic power system and method for manufacturing the same

    公开(公告)号:US10999955B2

    公开(公告)日:2021-05-04

    申请号:US16477321

    申请日:2017-12-22

    IPC分类号: H05K7/20

    摘要: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

    A FLOW DISTRIBUTION MODULE WITH A PATTERNED COVER PLATE
    7.
    发明申请
    A FLOW DISTRIBUTION MODULE WITH A PATTERNED COVER PLATE 审中-公开
    具有图案盖板的流动分配模块

    公开(公告)号:US20160109190A1

    公开(公告)日:2016-04-21

    申请号:US14680282

    申请日:2013-10-09

    IPC分类号: F28F3/12 F28F13/06 F28F9/02

    摘要: A flow distribution module (1) for distributing a flow of fluid over a surface to be cooled is disclosed. The flow distribution module (1) comprises a housing (2) and a cover plate (3). The housing (2) defines at least one flow cell (5), the flow cell(s) (5) being positioned in such a way that a flow of fluid flowing through a flow cell (5) from an inlet opening (6) to an outlet opening (7) is conveyed over the surface to be cooled, each flow cell (5) being formed to cause at least one change in the direction of flow of the fluid flowing through the flow cell (5). The cover plate (3) is arranged adjacent to the flow cell(s) (5) and defines the surface to be cooled. At least a part of the surface to be cooled defined by the cover plate (3) is provided with a surface pattern (8) of raised and depressed surface portions.

    摘要翻译: 公开了一种用于在要冷却的表面上分配流体流的流量分配模块(1)。 流量分配模块(1)包括壳体(2)和盖板(3)。 壳体(2)限定至少一个流动池(5),流动池(5)以这样的方式定位,使得从入口开口(6)流过流动池(5)的流体流动, 到出口开口(7)被输送到要冷却的表面上,每个流通池(5)被形成为使流过流动池(5)的流体的流动方向发生至少一个变化。 盖板(3)布置成邻近流动池(5)并限定待冷却的表面。 由盖板(3)限定的要冷却的表面的至少一部分设置有凸起和凹陷的表面部分的表面图案(8)。