Invention Grant
- Patent Title: Pad for electrodes
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Application No.: US15526858Application Date: 2015-09-30
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Publication No.: US10307103B2Publication Date: 2019-06-04
- Inventor: Takaaki Hatori , Yasuaki Shioyama , Kazuhiro Yoshikawa
- Applicant: SEKISUI PLASTICS CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI PLASTICS CO., LTD.
- Current Assignee: SEKISUI PLASTICS CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2014-233169 20141117; JP2015-074416 20150331
- International Application: PCT/JP2015/077727 WO 20150930
- International Announcement: WO2016/080082 WO 20160526
- Main IPC: A61B5/0408
- IPC: A61B5/0408 ; A61B5/0492 ; A61B5/00 ; C09J9/02 ; C09J133/26 ; C09J7/21 ; A61B5/0478

Abstract:
A pad for electrodes (1) including a first conductive adhesive sheet (2) for connection with an electrode, a second conductive adhesive sheet (4) for connection with another electrode, the second conductive adhesive sheet positioned to be spaced apart from the first conductive adhesive sheet in a planar direction of each conductive adhesive sheet, and a base (10) supporting the first conductive adhesive sheet and the second conductive adhesive sheet. At least one surface of each of the first conductive adhesive sheet and the second conductive adhesive sheet is exposed, and each of the first conductive adhesive sheet and the second conductive adhesive sheet has a thickness compressibility of 10% or less and a thickness recovery ratio of 95% or more. The base is a non-electroconductive base having a water absorption capacity of 1 to 1.5 times, and the pad has a moisture permeability of 1,000 g/m2/24 h or more.
Public/Granted literature
- US20170332967A1 PAD FOR ELECTRODES Public/Granted day:2017-11-23
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