Invention Grant
- Patent Title: Solder removal from semiconductor devices
-
Application No.: US15686008Application Date: 2017-08-24
-
Publication No.: US10307850B2Publication Date: 2019-06-04
- Inventor: Mark E. Tuttle
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/018 ; H01L23/00 ; H01L21/66 ; B23K101/40
Abstract:
A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
Public/Granted literature
- US20190061034A1 SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES Public/Granted day:2019-02-28
Information query
IPC分类:
