A warm-air blowing circuit and another warm-air blowing circuit are disposed so as to heat a film from both sides of a projection side and a recess side of a die, warm air reaches and heats the film from the time of supplying of the film, warm air continues to enter a space in which a resin is to be ejected even after the die is closed, and thereby the film is likely to extend. Therefore, the film is unlikely to be torn at the time of molding when the film is likely to be shaped after a shape of the die and it is possible to prevent broken pieces of the film or broken pieces of a decoration film from being mixed and being stuck to the surface of the die such that it is possible to improve quality of the external appearance of a molded product.