- Patent Title: Plating power supply with headroom control and ethercat interface
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Application No.: US16015481Application Date: 2018-06-22
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Publication No.: US10309031B2Publication Date: 2019-06-04
- Inventor: Charles A. Cummings , Mikael R. Borjesson
- Applicant: APPLIED Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Perkins Coie LLP
- Agent Kenneth H. Ohriner
- Main IPC: H02M7/02
- IPC: H02M7/02 ; C25D21/12
Abstract:
A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.
Public/Granted literature
- US20180298516A1 PLATING POWER SUPPLY WITH HEADROOM CONTROL AND ETHERCAT INTERFACE Public/Granted day:2018-10-18
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