公开(公告)号：US20170342589A1

公开(公告)日：2017-11-30

申请号：US15163097

申请日：2016-05-24

Applicant: APPLIED Materials, Inc.

Inventor： Charles A. Cummings ,  Mikael R. Borjesson

IPC: C25D21/12 ,  H02M7/02

CPC classification number: C25D21/12 ,  H02M7/02

Abstract: A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.

公开(公告)号：US20230167573A1

公开(公告)日：2023-06-01

申请号：US18159041

申请日：2023-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D17/00 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12

CPC classification number: C25D17/12 ,  C25D17/001 ,  C25D21/12 ,  C25D5/08 ,  C25D7/123 ,  C25D17/007

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US11578422B2

公开(公告)日：2023-02-14

申请号：US17583004

申请日：2022-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US20180298516A1

公开(公告)日：2018-10-18

申请号：US16015481

申请日：2018-06-22

Applicant: APPLIED Materials, Inc.

Inventor： Charles A. Cummings ,  Mikael R. Borjesson

IPC: C25D21/12 ,  H02M7/02

CPC classification number: C25D21/12 ,  H02M7/02

Abstract: A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.

公开(公告)号：US10023969B2

公开(公告)日：2018-07-17

申请号：US15163097

申请日：2016-05-24

Applicant: APPLIED Materials, Inc.

Inventor： Charles A. Cummings ,  Mikael R. Borjesson

IPC: C25D21/12 ,  H02M7/02

Abstract: A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.

公开(公告)号：US11982008B2

公开(公告)日：2024-05-14

申请号：US18159041

申请日：2023-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D21/12

CPC classification number: C25D17/12 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007 ,  C25D21/12

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US20220145489A1

公开(公告)日：2022-05-12

申请号：US17583004

申请日：2022-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D17/00 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US11159159B1

公开(公告)日：2021-10-26

申请号：US17015612

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Mikael R. Borjesson

IPC: H02M3/156 ,  H02M3/158 ,  H02M3/335 ,  G05F1/565 ,  G05F1/575 ,  C25D21/12 ,  H03K17/687 ,  H03F3/45

Abstract: A method of controlling a headroom voltage of a transistor stage of an electroplating system to maintain a target power dissipation across the transistor stage may include maintaining a headroom voltage in the transistor stage for a load in the electroplating system. The method may also include measuring an instantaneous power dissipation in the transistor stage and generating a difference output representing a difference between the instantaneous power dissipation in the transistor stage and the target power dissipation in the transistor stage. A voltage across the transistor stage and the load may then be adjusted using the difference output such that the headroom voltage in the transistor stage is adjusted to maintain the target power dissipation in the transistor stage.

公开(公告)号：US10309031B2

公开(公告)日：2019-06-04

申请号：US16015481

申请日：2018-06-22

Applicant: APPLIED Materials, Inc.

Inventor： Charles A. Cummings ,  Mikael R. Borjesson

IPC: H02M7/02 ,  C25D21/12

Abstract: A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.