Invention Grant
- Patent Title: Gas enclosure assembly and system
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Application No.: US15605806Application Date: 2017-05-25
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Publication No.: US10309665B2Publication Date: 2019-06-04
- Inventor: Justin Mauck , Alexander Sou-Kang Ko , Eliyahu Vronsky , Shandon Alderson
- Applicant: Kateeva, Inc.
- Applicant Address: US CA Newark
- Assignee: Kateeva, Inc.
- Current Assignee: Kateeva, Inc.
- Current Assignee Address: US CA Newark
- Agent Paula J. Tostado
- Main IPC: F24F3/16
- IPC: F24F3/16 ; B41J29/393 ; H05B33/10 ; F24F3/14 ; B05B17/00 ; H01L51/00 ; H01L51/56 ; H05B33/02

Abstract:
The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
Public/Granted literature
- US20170321911A1 Gas Enclosure Assembly and System Public/Granted day:2017-11-09
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