- 专利标题: Monolithic integration of high voltage transistors and low voltage non-planar transistors
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申请号: US15301282申请日: 2014-06-20
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公开(公告)号: US10312367B2公开(公告)日: 2019-06-04
- 发明人: Kinyip Phoa , Nidhi Nidhi , Chia-Hong Jan , Ting Chang
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Green, Howard & Mughal LLP
- 国际申请: PCT/US2014/043370 WO 20140620
- 国际公布: WO2015/195134 WO 20151223
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L29/08 ; H01L21/8234 ; H01L27/092
摘要:
High voltage transistors spanning multiple non-planar semiconductor bodies, such as fins or nanowires, are monolithically integrated with non-planar transistors utilizing an individual non-planar semiconductor body. The non-planar FETs may be utilized for low voltage CMOS logic circuitry within an IC, while high voltage transistors may be utilized for high voltage circuitry within the IC. A gate stack may be disposed over a high voltage channel region separating a pair of fins with each of the fins serving as part of a source/drain for the high voltage device. The high voltage channel region may be a planar length of substrate recessed relative to the fins. A high voltage gate stack may use an isolation dielectric that surrounds the fins as a thick gate dielectric. A high voltage transistor may include a pair of doped wells formed into the substrate that are separated by the high voltage gate stack with one or more fin encompassed within each well.
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