Invention Grant
- Patent Title: Solid state memory component
-
Application No.: US15860540Application Date: 2018-01-02
-
Publication No.: US10318170B2Publication Date: 2019-06-11
- Inventor: Jun Zhao , Gowrisankar Damarla , David A. Daycock , Gordon A. Haller , Sri Sai Sivakumar Vegunta , John B. Matovu , Matthew R. Park , Prakash Rau Mokhna Rau
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Thorpe North and Western, LLP
- Agent David W. Osborne
- Main IPC: G11C16/06
- IPC: G11C16/06 ; G06F3/06 ; H01L27/11573 ; H01L27/11575 ; H01L27/11582 ; H01L27/11565

Abstract:
Solid state memory technology is disclosed. A solid state memory component can include a plurality of bit lines, a source line, and a plurality of non-functional memory pillars. Each non-functional memory pillar is electrically isolated from one or both of the plurality of bit lines and the source line. A solid state memory component can include a plurality of pillars located in a periphery portion of the solid state memory component, and memory cells adjacent to each of the pillars. Associated systems and methods are also disclosed.
Public/Granted literature
- US20180307412A1 SOLID STATE MEMORY COMPONENT Public/Granted day:2018-10-25
Information query