Invention Grant
- Patent Title: Adaptive multi-tier power distribution grids for integrated circuits
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Application No.: US15432431Application Date: 2017-02-14
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Publication No.: US10318694B2Publication Date: 2019-06-11
- Inventor: Joon Hyung Chung , Mikhail Popovich , Gudoor Reddy
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP (36340)
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/40 ; H01L23/50 ; G06F17/50 ; H01L23/522 ; H01L23/528
Abstract:
The place and route stage for a hard macro including a plurality of tiles is modified so that some of the tiles are assigned a more robust power-grid tier and so that others ones of the tiles are assigned a less robust power-grid tier.
Public/Granted literature
- US20180144086A1 ADAPTIVE MULTI-TIER POWER DISTRIBUTION GRIDS FOR INTEGRATED CIRCUITS Public/Granted day:2018-05-24
Information query
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