Invention Grant
- Patent Title: Method and apparatus of seam finding
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Application No.: US15582460Application Date: 2017-04-28
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Publication No.: US10321052B2Publication Date: 2019-06-11
- Inventor: Michael L. Schmit , Radhakrishna Giduthuri , Kiriti Nagesh Gowda
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Volpe and Koenig, P.C.
- Main IPC: H04N5/232
- IPC: H04N5/232 ; H04N5/247

Abstract:
A method and apparatus of seam finding includes determining an overlap area between a first image and a second image. The first image is captured by a first image capturing device and the second image is captured by a second image capturing device. A plurality of seam paths for stitching the first image with the second image is computed and a cost is computed for each seam path. A seam is selected to stitch the first image to the second image based upon the cost for the seam path for that seam being less than a cost for all other computed seam paths, that seam is maintained as the selected seam for stitching based upon a predefined criteria.
Public/Granted literature
- US20180316851A1 METHOD AND APPARATUS OF SEAM FINDING Public/Granted day:2018-11-01
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