Invention Grant
- Patent Title: Flexible thermally-conductive shunt
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Application No.: US15471798Application Date: 2017-03-28
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Publication No.: US10321606B2Publication Date: 2019-06-11
- Inventor: Mark E. Sprenger , Kenan Arik , Michael S. Brazel
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F1/40 ; G06F1/20

Abstract:
Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20180284854A1 FLEXIBLE THERMALLY-CONDUCTIVE SHUNT Public/Granted day:2018-10-04
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