Invention Grant
- Patent Title: Printed chemical mechanical polishing pad
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Application No.: US14885955Application Date: 2015-10-16
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Publication No.: US10322491B2Publication Date: 2019-06-18
- Inventor: Mahendra Christopher Orilall , Timothy Michaelson , Kasiraman Krishnan , Rajeev Bajaj , Nag B. Patibandla , Daniel Redfield , Fred C. Redeker , Gregory E. Menk
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: B24B37/22
- IPC: B24B37/22 ; B24B37/24 ; B24B37/26 ; B33Y10/00 ; B33Y80/00 ; B24D18/00
Abstract:
A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.
Public/Granted literature
- US20160107288A1 PRINTED CHEMICAL MECHANICAL POLISHING PAD Public/Granted day:2016-04-21
Information query
