公开(公告)号：US12023853B2

公开(公告)日：2024-07-02

申请号：US16700062

申请日：2019-12-02

Applicant: Applied Materials, Inc.

Inventor： Kasiraman Krishnan ,  Daniel Redfield ,  Russell Edward Perry ,  Gregory E. Menk ,  Rajeev Bajaj ,  Fred C. Redeker ,  Nag B. Patibandla ,  Mahendra C. Orilall ,  Jason G. Fung

IPC: B29C64/112 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/00 ,  B29K105/16 ,  B29L31/00

CPC classification number: B29C64/112 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/001 ,  B29K2105/16 ,  B29K2995/007 ,  B29L2031/736

Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

公开(公告)号：US11980992B2

公开(公告)日：2024-05-14

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24B37/16 ,  B24B37/20 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/306

CPC classification number: B24B37/245 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y80/00 ,  B24B37/16 ,  B24B37/20 ,  B24D2203/00 ,  B33Y30/00 ,  H01L21/30625

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US11826876B2

公开(公告)日：2023-11-28

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Ankit Vora ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B24B37/22 ,  B24B37/24 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B24B37/26 ,  B24B7/22 ,  B22F10/14 ,  B33Y80/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58

CPC classification number: B24B7/22 ,  B22F10/14 ,  B24B37/24 ,  B24B37/26 ,  B29C64/112 ,  B33Y70/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58 ,  B33Y10/00 ,  B33Y80/00 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/10

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

公开(公告)号：US11745302B2

公开(公告)日：2023-09-05

申请号：US17209137

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24 ,  B33Y70/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00 ,  C09G1/16 ,  B33Y70/10 ,  B29K33/04 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D11/00 ,  B24D11/04 ,  B29C35/08 ,  C09D4/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B29C35/0805 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16 ,  B24D2203/00 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y70/10

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US11524384B2

公开(公告)日：2022-12-13

申请号：US16048574

申请日：2018-07-30

Applicant: Applied Materials, Inc.

Inventor： Ashwin Chockalingam ,  Rajeev Bajaj ,  Ashavani Kumar ,  Daniel Redfield

IPC: B24B37/26 ,  B24B37/24 ,  B24D3/34 ,  B24D11/04 ,  B24D3/20 ,  B24D3/28 ,  B24D11/00

Abstract: Embodiments of the present disclosure provide for abrasive delivery (AD) polishing pads and manufacturing methods thereof. In one embodiment, a method of forming a polishing article includes forming a sub-polishing element from a first curable resin precursor composition and forming a plurality of polishing elements extending from the sub-polishing element. Forming the plurality of polishing elements includes forming a continuous polymer phase from a second curable resin precursor composition and forming a plurality of discontinuous abrasive delivery features disposed within the continuous polymer phase. The sub-polishing element is formed by dispensing a first plurality of droplets of the first curable resin precursor composition. The plurality polishing elements are formed by dispensing a second plurality of droplets of the second curable resin precursor composition. In some embodiments, the discontinuous abrasive delivery features comprise a water soluble material having abrasive particles interspersed therein.

公开(公告)号：US20210379725A1

公开(公告)日：2021-12-09

申请号：US16897184

申请日：2020-06-09

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Mayu Felicia Yamamura ,  Daniel Redfield ,  Rajeev Bajaj ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00

Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US20210054222A1

公开(公告)日：2021-02-25

申请号：US16996744

申请日：2020-08-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Daihua Zhang ,  Uma Sridhar ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: C09D11/107 ,  C09K3/14 ,  B24B37/24 ,  B33Y70/10 ,  B33Y80/00 ,  B33Y40/10 ,  B29C64/112 ,  B33Y10/00

Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

公开(公告)号：US10821573B2

公开(公告)日：2020-11-03

申请号：US14887240

申请日：2015-10-19

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Khanna ,  Jason G. Fung ,  Mario Cornejo ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Ashavani Kumar ,  Venkat Hariharan ,  Gregory E. Menk ,  Fred C. Redeker ,  Nag B. Patibandla ,  Hou T. Ng ,  Robert E. Davenport ,  Amritanshu Sinha

IPC: B24B37/22 ,  B24B37/24 ,  B24D3/28 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US10589399B2

公开(公告)日：2020-03-17

申请号：US15461944

申请日：2017-03-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Edwin C. Suarez ,  Jason Garcheung Fung ,  Eric Lau ,  King Yi Heung ,  Ashwin Murugappan Chockalingam ,  Daniel Redfield ,  Charles C. Garretson ,  Thomas H. Osterheld

IPC: B24B37/26 ,  B24B37/10

Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.

公开(公告)号：US10399201B2

公开(公告)日：2019-09-03

申请号：US15296015

申请日：2016-10-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24D3/28 ,  C09D4/00 ,  C09G1/16 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/112 ,  B29C35/08 ,  B29K33/04 ,  B33Y70/00

Abstract: Embodiments herein relate to advanced polishing pads with tunable chemical, material and structural properties, and manufacturing methods related thereto. According to one or more embodiments herein, a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments herein thus may provide an advanced polishing pad having discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments herein further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.