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公开(公告)号：US11446788B2
公开(公告)日：2022-09-20
申请号：US16541641
申请日：2019-08-15
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Ashwin Chockalingam , Ashavani Kumar , Fred C. Redeker , Nag B. Patibandla
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US10199281B2
公开(公告)日：2019-02-05
申请号：US15891290
申请日：2018-02-07
Applicant: Applied Materials, Inc.
Inventor： Wei Lu , Zhihong Wang , Wen-Chiang Tu , Zhefu Wang , Hassan G. Iravani , Boguslaw A. Swedek , Fred C. Redeker , William H. McClintock
IPC: H01L21/66 , H01L21/321
Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.
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公开(公告)号：US20180166347A1
公开(公告)日：2018-06-14
申请号：US15891290
申请日：2018-02-07
Applicant: Applied Materials, Inc.
Inventor： Wei Lu , Zhihong Wang , Wen-Chiang Tu , Zhefu Wang , Hassan G. Iravani , Boguslaw A. Swedek , Fred C. Redeker , William H. McClintock
IPC: H01L21/66 , H01L21/321
CPC classification number: H01L22/14 , H01L21/3212 , H01L22/26 , H01L22/30
Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.
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公开(公告)号：US12194591B2
公开(公告)日：2025-01-14
申请号：US17684285
申请日：2022-03-01
Applicant: Applied Materials, Inc.
Inventor： Ekaterina A. Mikhaylichenko , Fred C. Redeker , Brian J. Brown , Chirantha Rodrigo , Steven M. Zuniga , Jay Gurusamy
Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.
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5.发明授权公开(公告)号：US11958162B2
公开(公告)日：2024-04-16
申请号：US16746065
申请日：2020-01-17
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Kasiraman Krishnan , Mahendra C. Orilall , Daniel Redfield , Fred C. Redeker , Nag B. Patibandla , Gregory E. Menk , Jason G. Fung , Russell Edward Perry , Robert E. Davenport
CPC classification number: B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0018 , B24D18/0045 , B29C64/112 , B33Y80/00
Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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Patent Agency Ranking
公开(公告)号：US10786885B2
公开(公告)日：2020-09-29
申请号：US15875867
申请日：2018-01-19
Applicant: Applied Materials, Inc.
Inventor： Robert D. Tolles , Gregory E. Menk , Eric Davey , You Wang , Huyen Karen Tran , Fred C. Redeker , Veera Raghava Reddy Kakireddy , Ekaterina Mikhaylichenko , Jay Gurusamy
Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.
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7.发明授权公开(公告)号：US09873180B2
公开(公告)日：2018-01-23
申请号：US14695299
申请日：2015-04-24
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Kasiraman Krishnan , Mahendra C. Orilall , Daniel Redfield , Fred C. Redeker , Nag B. Patibandla , Gregory E. Menk , Jason G. Fung , Russell Edward Perry , Robert E. Davenport
CPC classification number: B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0045 , B29C64/112 , B33Y80/00
Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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公开(公告)号：US12138733B2
公开(公告)日：2024-11-12
申请号：US17684285
申请日：2022-03-01
Applicant: Applied Materials, Inc.
Inventor： Ekaterina A. Mikhaylichenko , Fred C. Redeker , Brian J. Brown , Chirantha Rodrigo , Steven M. Zuniga , Jay Gurusamy
Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.
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公开(公告)号：US11471999B2
公开(公告)日：2022-10-18
申请号：US16042016
申请日：2018-07-23
Applicant: Applied Materials, Inc.
Inventor： Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
IPC: B24B37/24 , B24D11/04 , B24B37/26 , B24D18/00 , B24B37/16 , B24B37/20 , B33Y80/00 , B33Y10/00 , B29C64/112 , B33Y30/00 , H01L21/306
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US20220281062A1
公开(公告)日：2022-09-08
申请号：US17684285
申请日：2022-03-01
Applicant: Applied Materials, Inc.
Inventor： Ekaterina A. Mikhaylichenko , Fred C. Redeker , Brian J. Brown , Chirantha Rodrigo , Steven M. Zuniga , Jay Gurusamy
Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.
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