Invention Grant
- Patent Title: Retaining ring for CMP
-
Application No.: US15658294Application Date: 2017-07-24
-
Publication No.: US10322492B2Publication Date: 2019-06-18
- Inventor: Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson, P.C.
- Main IPC: B24B37/32
- IPC: B24B37/32 ; H01L21/306 ; H01L21/67 ; H01L21/687

Abstract:
A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.
Public/Granted literature
- US20180021918A1 RETAINING RING FOR CMP Public/Granted day:2018-01-25
Information query