Invention Grant
- Patent Title: Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
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Application No.: US15617266Application Date: 2017-06-08
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Publication No.: US10324127B2Publication Date: 2019-06-18
- Inventor: Yasuyuki Kato , Masataka Onozawa , Keisuke Nitta
- Applicant: ADVANTEST CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST CORPORATION
- Current Assignee: ADVANTEST CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/04

Abstract:
An electronic component handling apparatus (10) is provided which can improve the operation rate. The electronic component handling apparatus (10) includes: a contact arm (300) having a holding part (380) configured to hold a DUT (10A), the contact arm (300) being configured to press the DUT (10A) against a socket (410); an alignment device (200) including a camera (221) and a operation unit (230), the camera (221) being configured to image the DUT (10A) to acquire image information, the operation unit (230) being configured to adjust a position of the holding part (380) within a range of a maximum alignment amount (ALmax); and a control device (105) configured to control the contact arm (300) and the alignment device (200). When a predetermined condition is not satisfied, the control device (105) controls the contact arm (300) and the alignment device (200) so as to perform preliminary alignment work at least once. When the predetermined condition is satisfied, the control device (105) controls the contact arm (300) and the alignment device (200) so as to perform main alignment work.
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