公开(公告)号：US20230296666A1

公开(公告)日：2023-09-21

申请号：US18163056

申请日：2023-02-01

Applicant: ADVANTEST Corporation

Inventor： Yuya Yamada ,  Aritomo Kikuchi ,  Yasuyuki Kato

IPC: G01R31/28 ,  F28F13/12

CPC classification number: G01R31/2877 ,  F28F13/125 ,  G01R31/2886

Abstract: A temperature adjusting device adjusts a temperature of a device under test (DUT) electrically connected to a socket, and includes: a fluid connector connected to a fluid supply source that supplies a fluid; a heat exchanger thermally connected to at least one of the DUT and a carrier holding the DUT in a state that the at least one of the DUT and the carrier is pressed against the socket; a first flow path passing through an inside of the heat exchanger; and a first swirl flow forming part that swirls a flow of the fluid to form a first swirl flow and supplies the first swirl flow to the first flow path, the first swirl swirling along an inner surface of the first flow path around a first central axis of the first flow path.

公开(公告)号：US20200371158A1

公开(公告)日：2020-11-26

申请号：US16860515

申请日：2020-04-28

Applicant: ADVANTEST Corporation

Inventor： Yasuyuki Kato ,  Yuya Yamada ,  Shintaro Takaki ,  Hiroki Hosogai

IPC: G01R31/28 ,  G01R1/04

Abstract: An electronic component handling apparatus includes: a moving device that presses a device under test (DUT) against a socket of a test head. The moving device includes: a pusher that contacts the DUT; and a heater that heats the DUT through the pusher. The pusher includes: an internal space; and a first flow path that communicates with the internal space. Fluid from the test head is supplied to the internal space through the first flow path.

公开(公告)号：US10324127B2

公开(公告)日：2019-06-18

申请号：US15617266

申请日：2017-06-08

Applicant: ADVANTEST CORPORATION

Inventor： Yasuyuki Kato ,  Masataka Onozawa ,  Keisuke Nitta

IPC: G01R31/28 ,  G01R1/04

Abstract: An electronic component handling apparatus (10) is provided which can improve the operation rate. The electronic component handling apparatus (10) includes: a contact arm (300) having a holding part (380) configured to hold a DUT (10A), the contact arm (300) being configured to press the DUT (10A) against a socket (410); an alignment device (200) including a camera (221) and a operation unit (230), the camera (221) being configured to image the DUT (10A) to acquire image information, the operation unit (230) being configured to adjust a position of the holding part (380) within a range of a maximum alignment amount (ALmax); and a control device (105) configured to control the contact arm (300) and the alignment device (200). When a predetermined condition is not satisfied, the control device (105) controls the contact arm (300) and the alignment device (200) so as to perform preliminary alignment work at least once. When the predetermined condition is satisfied, the control device (105) controls the contact arm (300) and the alignment device (200) so as to perform main alignment work.

公开(公告)号：US11181576B2

公开(公告)日：2021-11-23

申请号：US16860515

申请日：2020-04-28

Applicant: ADVANTEST Corporation

Inventor： Yasuyuki Kato ,  Yuya Yamada ,  Shintaro Takaki ,  Hiroki Hosogai

IPC: G01R31/28 ,  G01R1/04

Abstract: An electronic component handling apparatus includes: a moving device that presses a device under test (DUT) against a socket of a test head. The moving device includes: a pusher that contacts the DUT; and a heater that heats the DUT through the pusher. The pusher includes: an internal space; and a first flow path that communicates with the internal space. Fluid from the test head is supplied to the internal space through the first flow path.

公开(公告)号：US11300609B2

公开(公告)日：2022-04-12

申请号：US17018456

申请日：2020-09-11

Applicant: ADVANTEST Corporation

Inventor： Yasuyuki Kato ,  Natsuki Shiota

IPC: G01R31/28

Abstract: An electronic component presser is included in an electronic component testing apparatus used to test a device under test (DUT). The electronic component testing apparatus includes an electronic component handler, an electronic component tester, and a first socket. The electronic component presser connects to the electronic component handler and to the electronic component tester. The electronic component presser includes: a holding plate that holds the DUT that has been carried to the holding plate by a contact arm of the electronic component handler; a transport unit that moves the DUT between the holding plate and the first socket; a pusher that presses the DUT that has been disposed on the first socket; and an antenna unit comprising a measurement antenna that faces a device antenna of the DUT disposed on the first socket.

公开(公告)号：US20220082613A1

公开(公告)日：2022-03-17

申请号：US17018456

申请日：2020-09-11

Applicant: ADVANTEST Corporation

Inventor： Yasuyuki Kato ,  Natsuki Shiota

IPC: G01R31/28

Abstract: An electronic component presser is included in an electronic component testing apparatus used to test a device under test (DUT). The electronic component testing apparatus includes an electronic component handler, an electronic component tester, and a first socket. The electronic component presser connects to the electronic component handler and to the electronic component tester. The electronic component presser includes: a holding plate that holds the DUT that has been carried to the holding plate by a contact arm of the electronic component handler; a transport unit that moves the DUT between the holding plate and the first socket; a pusher that presses the DUT that has been disposed on the first socket; and an antenna unit comprising a measurement antenna that faces a device antenna of the DUT disposed on the first socket.