Invention Grant
- Patent Title: Ground pattern for solderability and radio-frequency properties in millimeter-wave packages
-
Application No.: US15850097Application Date: 2017-12-21
-
Publication No.: US10325850B1Publication Date: 2019-06-18
- Inventor: Emmanuelle R. O. Convert , Ryan M. Clement , Simon J. Mahon , Leif G. M. Snygg
- Applicant: MACOM Technology Solutions Holdings, Inc.
- Applicant Address: US MA Lowell
- Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
- Current Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
- Current Assignee Address: US MA Lowell
- Agency: Thomas | Horstemeyer, LLP
- Agent Michael J. D'Aurelio; Jason M. Perilla
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01P3/10 ; H01L23/492 ; H01L23/66 ; H01L23/06 ; H01L23/498

Abstract:
An apparatus includes a laminate and a lid. The laminate generally includes a dielectric layer between a first conductive layer and a second conductive layer. The first conductive layer may include a probe configured to transfer a radio-frequency signal in a millimeter-wave band. The second conductive layer may be configured to provide a continuous ground plane parallel to the probe and separated from the probe by the dielectric layer. A plurality of channels may be (a) formed into a side of the second conductive layer opposite the dielectric layer, (b) formed to a depth less than a thickness of the second conductive layer, and (c) sized to permit gasses formed while securing the laminate to a substrate to escape from between the laminate and the substrate. The lid may be in contact with the first conductive layer.
Information query
IPC分类: