- 专利标题： Dry film solder mask composite laminate materials
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申请号： US14735395申请日： 2015-06-10
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公开(公告)号： US10327336B2公开(公告)日： 2019-06-18
- 发明人: Sarah K. Czaplewski , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Patterson + Sheridan, LLP
- 主分类号： B32B27/08
- IPC分类号： B32B27/08 ; B32B27/00 ; B32B27/38 ; H05K3/00 ; H05K1/09 ; H05K3/34 ; H05K3/22 ; H05K3/28
摘要：
In an example, a dry film solder mask (DFSM) composite laminate material is disclosed. The DFSM composite laminate material includes a printed circuit board (PCB) laminate material, a cyclic compound chemically bonded to the PCB laminate material, and a DFSM material. The DFSM material is reversibly bonded to the PCB laminate material via the cyclic compound.
公开/授权文献
- US20160338196A1 DRY FILM SOLDER MASK COMPOSITE LAMINATE MATERIALS 公开/授权日：2016-11-17