Invention Grant
- Patent Title: Silicone composition
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Application No.: US15523567Application Date: 2014-12-25
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Publication No.: US10329424B2Publication Date: 2019-06-25
- Inventor: Yasuyoshi Watanabe , Gaku Kitada
- Applicant: POLYMATECH JAPAN CO., LTD.
- Applicant Address: JP Saitama
- Assignee: POLYMATECH JAPAN CO., LTD.
- Current Assignee: POLYMATECH JAPAN CO., LTD.
- Current Assignee Address: JP Saitama
- Agency: Cermak Nakajima & McGowan LLP
- Agent Tomoko Nakajima
- International Application: PCT/JP2014/084417 WO 20141225
- International Announcement: WO2016/103424 WO 20160630
- Main IPC: H01B1/20
- IPC: H01B1/20 ; C09D5/24 ; C08L83/04 ; C08K3/22 ; C08K3/36 ; C09K5/14 ; C08L1/02 ; C08L3/02 ; C08G77/20 ; C08L5/00

Abstract:
The silicone composition is one that contains liquid silicone, at least one insoluble functionalizing filler, such as a thermally or electrically conductive filler, and a non-liquid anti-thickening or non-thickening anti-settling material, such as a cellulose compound or polysaccharide. In a system that contains liquid silicone and insoluble functionalizing filler(s), a polysaccharide functions as an anti-thickening or non-thickening anti-settling material, providing a low-viscosity and filler-rich silicone composition.
Public/Granted literature
- US20170313881A1 Silicone Composition Public/Granted day:2017-11-02
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