Abstract:
The silicone composition is one that contains liquid silicone, at least one insoluble functionalizing filler, such as a thermally or electrically conductive filler, and a non-liquid anti-thickening or non-thickening anti-settling material, such as a cellulose compound or polysaccharide. In a system that contains liquid silicone and insoluble functionalizing filler(s), a polysaccharide functions as an anti-thickening or non-thickening anti-settling material, providing a low-viscosity and filler-rich silicone composition.
Abstract:
A curable thermally conductive grease la contains a curable liquid polymer, a thermally conductive filler (A) having an average particle diameter of less than 10 μm, and a thermally conductive filler (B) having an average particle diameter of 10 μm or more, the ratio by volume of the thermally conductive filler (A) to the thermally conductive filler (B), i.e., (A)/(B), being 0.65 to 3.02, and the curable thermally conductive grease having a viscosity of 700 Pa·s to 2070 Pa·s, in which after the curable thermally conductive grease is applied to the heat-generating body or the heat-dissipating body to a thickness of 5 mm, the curable thermally conductive grease has slump resistance in which the curable thermally conductive grease does not flow down when the heat-generating body or the heat-dissipating body is vertically arranged.
Abstract:
The silicone composition is one that contains liquid silicone, at least one insoluble functionalizing filler, such as a thermally or electrically conductive filler, and a non-liquid anti-thickening or non-thickening anti-settling material, such as a cellulose compound or polysaccharide. In a system that contains liquid silicone and insoluble functionalizing filler(s), a polysaccharide functions as an anti-thickening or non-thickening anti-settling material, providing a low-viscosity and filler-rich silicone composition.