Invention Grant
- Patent Title: Composite electronic component
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Application No.: US15274528Application Date: 2016-09-23
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Publication No.: US10332680B2Publication Date: 2019-06-25
- Inventor: Ho Yoon Kim , Soo Hwan Son , Man Su Byun
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2016-0015747 20160211
- Main IPC: H01C1/06
- IPC: H01C1/06 ; H01C7/00 ; H01C7/18 ; H01G2/14 ; H01G2/22 ; H01G4/30 ; H01F17/00 ; H01F27/29

Abstract:
A composite electronic component includes: a body part including a dielectric portion; first and second external electrodes disposed on outer surfaces of the body part; a plurality of first and second electrodes disposed inside of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; third and fourth electrodes disposed on an upper portion of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; a gap provided between the third and fourth electrodes; a groove disposed below the gap; and an electrostatic discharge (ESD) layer disposed in the gap.
Public/Granted literature
- US20170236640A1 COMPOSITE ELECTRONIC COMPONENT Public/Granted day:2017-08-17
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