Invention Grant
- Patent Title: Structure light module using vertical cavity surface emitting laser array
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Application No.: US15795130Application Date: 2017-10-26
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Publication No.: US10333277B2Publication Date: 2019-06-25
- Inventor: Tsung-Wei Wan , Wei-Ping Chen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01S5/183
- IPC: H01S5/183 ; H01L21/02 ; H01S3/08

Abstract:
A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a second spacer disposes on the wafer level lens; a DOE disposed on the second spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
Public/Granted literature
- US20190131771A1 STRUCTURE LIGHT MODULE USING VERTICAL CAVITY SURFACE EMITTING LASER ARRAY Public/Granted day:2019-05-02
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