Invention Grant
- Patent Title: Printed circuit board to molded compound interface
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Application No.: US15571015Application Date: 2015-07-31
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Publication No.: US10342140B2Publication Date: 2019-07-02
- Inventor: Chien-Hua Chen , Gary G. Lutnesky , Michael W. Cumbie , Eric L. Nikkel
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/043064 WO 20150731
- International Announcement: WO2017/023238 WO 20170209
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H05K1/02 ; H05K3/28 ; H05K1/18 ; H05K3/46 ; B41J2/16
Abstract:
A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.
Public/Granted literature
- US20180168049A1 PRINTED CIRCUIT BOARD TO MOLDED COMPOUND INTERFACE Public/Granted day:2018-06-14
Information query
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