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公开(公告)号：US11117376B2
公开(公告)日：2021-09-14
申请号：US16226904
申请日：2018-12-20
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Si-lam J. Choy , Devin Mourey , Eric L. Nikkel
Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.
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Patent Agency Ranking
公开(公告)号：US20180372243A1
公开(公告)日：2018-12-27
申请号：US16062379
申请日：2016-04-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Eric L. Nikkel
Abstract: An example fluidic micro electromechanical system may include a substrate and a first layer supported by the substrate. The first layer forms sides of a chamber, a passage through one of the sides and a chamber and a check valve leaf. The check valve leaf is pivotable about an axis nonparallel to the substrate to open and close the passage. The system may further include a second layer over the chamber, an opening into the chamber and a resistor supported within the chamber.
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公开(公告)号：US10557567B2
公开(公告)日：2020-02-11
申请号：US16062379
申请日：2016-04-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Eric L. Nikkel
Abstract: An example fluidic micro electromechanical system may include a substrate and a first layer supported by the substrate. The first layer forms sides of a chamber, a passage through one of the sides and a chamber and a check valve leaf. The check valve leaf is pivotable about an axis nonparallel to the substrate to open and close the passage. The system may further include a second layer over the chamber, an opening into the chamber and a resistor supported within the chamber.
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公开(公告)号：US10342140B2
公开(公告)日：2019-07-02
申请号：US15571015
申请日：2015-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Gary G. Lutnesky , Michael W. Cumbie , Eric L. Nikkel
Abstract: A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.
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公开(公告)号：US20190118535A1
公开(公告)日：2019-04-25
申请号：US16226904
申请日：2018-12-20
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Silam J. Choy , Devin Mourey , Eric L. Nikkel
Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.
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公开(公告)号：US20180168049A1
公开(公告)日：2018-06-14
申请号：US15571015
申请日：2015-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Gary G. Lutnesky , Michael W. Cumbie , Eric L. Nikkel
CPC classification number: H05K3/284 , B41J2/14072 , B41J2/1408 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1637 , B41J2/1643 , H05K1/0271 , H05K1/181 , H05K3/46 , H05K2201/068 , H05K2203/1327
Abstract: A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.
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