- 专利标题: Substrate transfer chamber
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申请号: US14933635申请日: 2015-11-05
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公开(公告)号: US10347516B2公开(公告)日: 2019-07-09
- 发明人: Sriskantharajah Thirunavukarasu , Eng Sheng Peh , Srinivas D. Nemani , Arvind Sundarrajan , Avinash Avula , Ellie Y. Yieh
- 申请人: APPLIED MATERIALS, INC.
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Moser Taboada
- 代理商 Alan Taboada
- 主分类号: H01L21/673
- IPC分类号: H01L21/673 ; H01L21/677 ; H01L21/67
摘要:
Embodiments of substrate transfer chambers are provided herein. In some embodiments, a substrate transfer chamber includes a body having an interior volume, wherein a bottom portion of the body includes a first opening; an adapter plate coupled to the bottom portion of the body to couple the substrate transfer chamber to a load lock chamber of a substrate processing system; wherein the adapter plate includes a second opening aligned with the first opening to fluidly couple the interior volume with an inner volume of the load lock chamber; a cassette support disposed in the interior volume to support a substrate cassette; and a lift actuator coupled to the cassette support to lower or raise the substrate cassette into or out of the load lock chamber.
公开/授权文献
- US20160133494A1 SUBSTRATE TRANSFER CHAMBER 公开/授权日:2016-05-12
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