- 专利标题: Semiconductor device manufacturing apparatus and method
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申请号: US15061970申请日: 2016-03-04
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公开(公告)号: US10347603B2公开(公告)日: 2019-07-09
- 发明人: Masayuki Miura
- 申请人: TOSHIBA MEMORY CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: TOSHIBA MEMORY CORPORATION
- 当前专利权人: TOSHIBA MEMORY CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Kim & Stewart LLP
- 优先权: JP2015-097594 20150512
- 主分类号: B23K20/00
- IPC分类号: B23K20/00 ; B23K20/02 ; H01L23/00
摘要:
A semiconductor device manufacturing apparatus includes a stage, a head section facing the stage and configured to hold a semiconductor element, a driving section configured to drive one of the head section and the stage to move in a first direction intersecting the head section and the stage and apply a load to the other one of the stage and the head section, a load sensor configured to sense a load value of the applied load, and a controller configured to control the driving section to move one of the head section and the stage, and then separate the head section from the stage in accordance with a change in the load value.
公开/授权文献
- US20160336291A1 SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD 公开/授权日:2016-11-17
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