- 专利标题: Forming spacer for trench epitaxial structures
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申请号: US15972547申请日: 2018-05-07
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公开(公告)号: US10347632B2公开(公告)日: 2019-07-09
- 发明人: Injo Ok , Balasubramanian Pranatharthiharan , Soon-Cheon Seo , Charan V. V. S. Surisetty
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- 代理商 Steven J. Meyers; Andrew M. Calderon
- 主分类号: H01L21/70
- IPC分类号: H01L21/70 ; H01L27/092 ; H01L21/8238
摘要:
The disclosure relates to a structure and methods of forming spacers for trench epitaxial structures. The method includes: forming a spacer material between source and drain regions of respective first-type gate structures and second-type gate structures; growing source and drain material about the first-type gate structures, confined within an area defined by the spacer material; and growing source and drain material about the second-type gate structures, confined within an area defined by the spacer material.
公开/授权文献
- US20180254274A1 SPACER FOR TRENCH EPITAXIAL STRUCTURES 公开/授权日:2018-09-06
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