Invention Grant
- Patent Title: Radiofrequency switch device and manufacturing method thereof
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Application No.: US15802419Application Date: 2017-11-02
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Publication No.: US10347733B2Publication Date: 2019-07-09
- Inventor: Wanxun He , Su Xing
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201710929657 20171009
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/06 ; H01L23/66

Abstract:
A radiofrequency switch device includes an insulation layer, a semiconductor layer, a gate structure, a first doped region, a second doped region, an epitaxial layer, a first silicide layer, and a second silicide layer. The semiconductor layer is disposed on the insulation layer. The gate structure is disposed on the semiconductor layer. The first doped region and the second doped region are disposed in the semiconductor layer at two opposite sides of the gate structure respectively. The epitaxial layer is disposed on the first doped region. The first silicide layer is disposed on the epitaxial layer. The second silicide layer is disposed in the second doped region.
Public/Granted literature
- US20190109200A1 RADIOFREQUENCY SWITCH DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-04-11
Information query
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