发明授权
- 专利标题: MEMS microphone
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申请号: US15573235申请日: 2016-05-05
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公开(公告)号: US10349185B2公开(公告)日: 2019-07-09
- 发明人: Yonggang Hu
- 申请人: CSMC TECHNOLOGIES FAB2 CO., LTD.
- 申请人地址: CN Wuxi New District
- 专利权人: CSMC TECHNOLOGIES FAB2 CO., LTD.
- 当前专利权人: CSMC TECHNOLOGIES FAB2 CO., LTD.
- 当前专利权人地址: CN Wuxi New District
- 代理机构: Kagan Binder, PLLC
- 优先权: CN201510244099 20150513
- 国际申请: PCT/CN2016/081062 WO 20160505
- 国际公布: WO2016/180262 WO 20161117
- 主分类号: H04R19/04
- IPC分类号: H04R19/04 ; H04R1/08 ; B81B3/00 ; H04R7/06 ; H04R7/18 ; H04R19/00
摘要:
An MEMS microphone comprises a substrate (100), a support portion (200), a superimposed layer (600), an upper plate (300) and a lower plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower plate (400) is arranged above and spanning the substrate (100); the support portion (200) is fixed on the lower plate (400); the upper plate (300) is attached on the support portion (200); an accommodation cavity (500) is formed from the support portion (200), the upper plate (300) and the lower plate (400); the superimposed layer (600) is attached on an central region of the upper plate (300) or the lower plate (400), and insulation is achieved between the upper plate (300) and a lower plate (400).
公开/授权文献
- US20180139544A1 MEMS MICROPHONE 公开/授权日:2018-05-17
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