- 专利标题: Fine silver particle dispersing solution
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申请号: US15126062申请日: 2015-05-12
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公开(公告)号: US10350679B2公开(公告)日: 2019-07-16
- 发明人: Yu Murano , Hidefumi Fujita , Daisuke Itoh , Shuji Yamashita , Daiki Yoshihara
- 申请人: Dowa Electronics Materials Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Dowa Electronics Materials Co., Ltd.
- 当前专利权人: Dowa Electronics Materials Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Bachman & LaPointe, PC
- 优先权: JP2014-102981 20140519
- 国际申请: PCT/JP2015/064125 WO 20150512
- 国际公布: WO2015/178326 WO 20151126
- 主分类号: B22F1/00
- IPC分类号: B22F1/00 ; C09D7/65 ; C08K3/08 ; H01B1/02 ; B22F1/02 ; B22F9/24 ; H01B1/22 ; C09D5/24 ; C09D11/03 ; C09D11/033 ; C09D11/037 ; C09D11/52 ; H05K1/09
摘要:
In a fine silver particle dispersing solution wherein 30 to 75% by weight of fine silver particles, which are coated with an organic acid having a carbon number of 5 to 8 or a derivative thereof and which have an average particle diameter of 1 to 100 nm, are dispersed in a water-based dispersion medium which is a solvent containing water as a main component, the fine silver particle dispersing solution containing ammonia and nitric acid, there is added 0.15 to 0.6% by weight of a surface regulating agent, which preferably contains a polyether-modified polydimethylsiloxane and a polyoxyethylene alkyl ether or a polyether, or 0.005 to 0.6% by weight of an antifoaming agent which is preferably a silicone antifoaming agent.
公开/授权文献
- US20170087633A1 FINE SILVER PARTICLE DISPERSING SOLUTION 公开/授权日:2017-03-30
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