Invention Grant
- Patent Title: Chemical control features in wafer process equipment
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Application No.: US15581357Application Date: 2017-04-28
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Publication No.: US10354843B2Publication Date: 2019-07-16
- Inventor: Qiwei Liang , Xinglong Chen , Kien Chuc , Dmitry Lubomirsky , Soonam Park , Jang-Gyoo Yang , Shankar Venkataraman , Toan Tran , Kimberly Hinckley , Saurabh Garg
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: C23C16/455
- IPC: C23C16/455 ; H01J37/32 ; B05B1/00 ; C23C16/452 ; B05B1/18 ; C23C16/50 ; H01L21/67

Abstract:
Gas distribution assemblies are described including an annular body, an upper plate, and a lower plate. The upper plate may define a first plurality of apertures, and the lower plate may define a second and third plurality of apertures. The upper and lower plates may be coupled with one another and the annular body such that the first and second apertures produce channels through the gas distribution assemblies, and a volume is defined between the upper and lower plates.
Public/Granted literature
- US20170236691A1 CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT Public/Granted day:2017-08-17
Information query
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