Invention Grant
- Patent Title: Apparatus and method for conformal coating of integrated circuit packages
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Application No.: US15257726Application Date: 2016-09-06
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Publication No.: US10356912B2Publication Date: 2019-07-16
- Inventor: Priyanka Dobriyal , Suriyakala Ramalingam , Chester C. Lee , Raiyomand F. Aspandiar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/28 ; H01L21/56
Abstract:
An electronic system includes a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer includes parylene. Furthermore, the electronic system includes an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments being described and/or claimed.
Public/Granted literature
- US20180070456A1 CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES Public/Granted day:2018-03-08
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