公开(公告)号：US10356912B2

公开(公告)日：2019-07-16

申请号：US15257726

申请日：2016-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Suriyakala Ramalingam ,  Chester C. Lee ,  Raiyomand F. Aspandiar

IPC: H05K1/18 ,  H05K3/28 ,  H01L21/56

Abstract: An electronic system includes a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer includes parylene. Furthermore, the electronic system includes an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments being described and/or claimed.

公开(公告)号：US20180070456A1

公开(公告)日：2018-03-08

申请号：US15257726

申请日：2016-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Suriyakala Ramalingam ,  Chester C. Lee ,  Raiyomand F. Aspandiar

IPC: H05K3/28 ,  H05K1/18 ,  H01L21/56

CPC classification number: H05K3/284 ,  H01L21/563 ,  H05K1/18 ,  H05K3/285 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1338 ,  H05K2203/304

Abstract: An electronic system may include a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer may include parylene. Furthermore, the electronic system may include an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments may be described and/or claimed.