Invention Grant
- Patent Title: Magnetic power coupling to an integrated circuit module
-
Application No.: US14815853Application Date: 2015-07-31
-
Publication No.: US10361023B2Publication Date: 2019-07-23
- Inventor: William J. Dally , Thomas Hastings Greer, III , Sudhir Shrikantha Kudva
- Applicant: NVIDIA Corporation
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: H02J5/00
- IPC: H02J5/00 ; H01F27/02 ; H01F27/24 ; H01F27/28 ; H01F38/14 ; H02J50/10

Abstract:
A magnetic power supply coupling system is disclosed. An integrated circuit module includes an integrated circuit die and a secondary winding that is configured to generate an induced, alternating current based on a magnetic flux. A primary winding is external to the integrated circuit module, proximate to the integrated circuit module, and coupled to a main power supply corresponding to an alternating current that generates the magnetic flux. The induced, alternating current is converted into a direct current at a voltage level to supply power to the integrated circuit die.
Public/Granted literature
- US20160043569A1 MAGNETIC POWER COUPLING TO AN INTEGRATED CIRCUIT MODULE Public/Granted day:2016-02-11
Information query