Invention Grant
- Patent Title: Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
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Application No.: US14581460Application Date: 2014-12-23
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Publication No.: US10361182B2Publication Date: 2019-07-23
- Inventor: Hiroshi Tamagawa , Yasuhiro Kondo , Hiroki Yamamoto
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2013-272825 20131227; JP2013-272826 20131227; JP2014-225234 20141105
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L27/01 ; H01G4/30 ; H01G4/33 ; H01C1/14 ; H01C1/142 ; H01C7/00 ; H01C17/00 ; H01G4/012 ; H05K1/16 ; H01L27/08 ; H01L49/02
Abstract:
The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.
Public/Granted literature
Information query
