Invention Grant
- Patent Title: Transverse bulk acoustic wave filter
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Application No.: US15639495Application Date: 2017-06-30
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Publication No.: US10361677B2Publication Date: 2019-07-23
- Inventor: Christopher Bower , Matthew Meitl , Ronald S. Cok , Robert R. Rotzoll
- Applicant: X-Celeprint Limited
- Applicant Address: IE Cork
- Assignee: X-Celeprint Limited
- Current Assignee: X-Celeprint Limited
- Current Assignee Address: IE Cork
- Agency: Choate, Hall & Stewart LLP
- Agent William R. Haulbrook; Michael D. Schmitt
- Main IPC: H03H9/56
- IPC: H03H9/56 ; H03H9/17 ; H03H9/02 ; H03H9/05 ; H03H9/54 ; H03H9/00 ; H03H9/58 ; H03H9/13 ; H03H9/145 ; H03H3/02 ; H03H3/08 ; H03H9/64

Abstract:
A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.
Public/Granted literature
- US20170310299A1 TRANSVERSE BULK ACOUSTIC WAVE FILTER Public/Granted day:2017-10-26
Information query
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